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IBM PLANT IN VERMONT TO USE INNOVATIVE MANUFACTURING PROCESS

Release Date: 08/03/2000
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FOR RELEASE: THURSDAY, AUGUST 3, 2000

IBM PLANT IN VERMONT TO USE INNOVATIVE MANUFACTURING PROCESS

On July 31, EPA reached an agreement with IBM for its Essex Junction, Vt., semiconductor chip plant that will produce environmental benefits and allow for a new innovative manufacturing process that is more energy efficient and produce faster, more energy efficient products. The agreement will result in significant reductions in emissions of greenhouse gases known as Perfluorinated Compounds. A key cost-saving benefit is the promotion of a new process, copper metalization, which has the potential to impact the electronics industry. The process is approximately 30-40 percent more energy efficient than the previously used one and produces a chip that is approximately 25 percent more energy efficient. To run this process, IBM seeks flexibility from regulations under the Resource Conservation and Recovery Act (RCRA) which characterize wastewater treatment sludge. Since the sludge produced from this new process does not contain hazardous materials, IBM proposes that the copper metalization process be exempt from the RCRA regulations. This project will provide for environmental protection, innovation and competitiveness in the world market. The agreement was reached under EPA’s Project XL, which stands for “eXcellence and Leadership”, a national initiative that tests innovative ways of achieving better and more cost-effective public health and environmental protection. The information and lessons learned from Project XL are being used in redesigning EPA’s current regulatory and policy-setting approaches. Further information is available at: https://www.epa.gov/projectxl .

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